설명
Automated Debonding System환경 설정
환경 설정 없음OEM 모델 설명
EVG850 DB Automated Debonding System Within the fully automated debonder, the processed temporary bonding wafer stack is separated and cleaned, with the fragile device wafer always supported throughout the whole tool. Supported debonding methods include UV laser, thermal and mechanical debonding. With all debonding methods, the device wafer is either supported through film frame mounting or through a thin wafer handler.문서
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EVGroup (EVG)
EVG850 DB
검증됨
카테고리
Bonder/Debonder
마지막 검증일: 22일 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
106473
웨이퍼 사이즈:
8"/200mm
빈티지:
알 수 없음
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
EVGroup (EVG)
EVG850 DB
카테고리
Bonder/Debonder
마지막 검증일: 22일 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
106473
웨이퍼 사이즈:
8"/200mm
빈티지:
알 수 없음
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
설명
Automated Debonding System환경 설정
환경 설정 없음OEM 모델 설명
EVG850 DB Automated Debonding System Within the fully automated debonder, the processed temporary bonding wafer stack is separated and cleaned, with the fragile device wafer always supported throughout the whole tool. Supported debonding methods include UV laser, thermal and mechanical debonding. With all debonding methods, the device wafer is either supported through film frame mounting or through a thin wafer handler.문서
문서 없음