MCU 3000
카테고리
Bonder/Debonder개요
MCU 3000 is used to temporary bond and de-bond the device wafer with our T-ESC´s. It is suited to low volume or R&D production, a trained operator can achieve between 15-25 bonds and de-bonds per hour.
활성 등재물
0
서비스
검사, 보험, 감정, 물류
상위 등재물
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