SYNAPSE S
카테고리
Bonder/Debonder개요
Synapse™ S, a wafer fusion bonding equipment widely used in 300mm CMOS image sensor mass production lines. Original wafer bonder, built on the Lithius frame.
활성 등재물
0
서비스
검사, 보험, 감정, 물류
상위 등재물
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Synapse™ S, a wafer fusion bonding equipment widely used in 300mm CMOS image sensor mass production lines. Original wafer bonder, built on the Lithius frame.
0
검사, 보험, 감정, 물류