설명
FE환경 설정
환경 설정 없음OEM 모델 설명
The ESEC Die Bonder 2008hSplus is the successful combination of the speed and reliability of the proven high-volume 2008hS platform with the flexibility and accuracy of the award-winning high-end 2008xP platform. The ultra fast vision system together with the enhanced Pick & Place enable production runs of 13,000 units per hour. The 2008hSplus is the ultimate epoxy die bonder with regards to handling metal lead frames, substrates, thin die, stacked die and wafer back side lamination. Of course this bonder family handle문서
문서 없음
BESI / ESEC
2008 HS PLUS
검증됨
카테고리
Bonders
마지막 검증일: 5일 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
100239
웨이퍼 사이즈:
알 수 없음
빈티지:
알 수 없음
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
유사 등재물
모두 보기유사 등재물 없음
BESI / ESEC
2008 HS PLUS
카테고리
Bonders
마지막 검증일: 5일 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
100239
웨이퍼 사이즈:
알 수 없음
빈티지:
알 수 없음
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
설명
FE환경 설정
환경 설정 없음OEM 모델 설명
The ESEC Die Bonder 2008hSplus is the successful combination of the speed and reliability of the proven high-volume 2008hS platform with the flexibility and accuracy of the award-winning high-end 2008xP platform. The ultra fast vision system together with the enhanced Pick & Place enable production runs of 13,000 units per hour. The 2008hSplus is the ultimate epoxy die bonder with regards to handling metal lead frames, substrates, thin die, stacked die and wafer back side lamination. Of course this bonder family handle문서
문서 없음
유사 등재물
모두 보기유사 등재물 없음