8090
카테고리
Bonders개요
The Model 8090, a large area wedge bonder designed to process the large panels and carriers used in chip-on-board (COB), multi-chip modules (MCMs) and similar devices.
활성 등재물
1
서비스
검사, 보험, 감정, 물류
The Model 8090, a large area wedge bonder designed to process the large panels and carriers used in chip-on-board (COB), multi-chip modules (MCMs) and similar devices.
1
검사, 보험, 감정, 물류
