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AT PREMIER

카테고리
Bonders
개요

The AT Premier is targeted for gold-to-gold interconnect in the growing flip chip market. With industry leading speed and technology, the machine lowers the cost of ownership for stud bumping, enabling a wider range of applications than previously served.

활성 등재물

3

서비스

검사, 보험, 감정, 물류

상위 등재물

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