BA8
카테고리
Bonders개요
The semi-automated bond aligner BA8 is designed for high-precision alignment and subsequent reliable bonding of wafers and substrates up to 200 mm.
활성 등재물
1
서비스
검사, 보험, 감정, 물류
The semi-automated bond aligner BA8 is designed for high-precision alignment and subsequent reliable bonding of wafers and substrates up to 200 mm.
1
검사, 보험, 감정, 물류
