설명
FC-150 Flip Chip Bonder -100 KG bond pressure - 20Amps - 220V, 60Hz Optional equipment installed: - Chip Flipper - Automatic Alignment (Cognex 8000) - Advanced Laser Leveling - Universal Bonding Arm (UBA) - High Precision SET Reflow Arm (SRA) - Force Sensor in Stage - This tool powers on, launches software and completes initialization process (tool reset)환경 설정
환경 설정 없음OEM 모델 설명
Available as a completely automated system to level, align and package components down to 200 µm, the FC150 supports the complete range of bonding applications, including optoelectronics and MCM. The SUSS FC150 Bonder offers you the latest evolution in bonding technologies: ultrasonic/thermo-sonic, laser welding. With configurations ranging from manual to full automation, the FC150 provides development and production capabilities on a single upgradeable cost-effective platform. The FC150 can be equipped with tooling enabling all known bonding processes (i.e. Thermocompression, Adhesives, Reflow...) to perform wafer-to-wafer bonding, with round or square substrate sizes up to 100 mm diameter at +/- 1 µm post-bonding accuracy문서
SUSS MicroTec / KARL SUSS
FC-150
검증됨
카테고리
Bonders
마지막 검증일: 7일 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
82531
웨이퍼 사이즈:
알 수 없음
빈티지:
1999
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
SUSS MicroTec / KARL SUSS
FC-150
카테고리
Bonders
마지막 검증일: 7일 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
82531
웨이퍼 사이즈:
알 수 없음
빈티지:
1999
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available