MCU 3000
카테고리
Bonders개요
MCU 3000 is used to temporary bond and de-bond the device wafer with our T-ESC´s. It is suited to low volume or R&D production, a trained operator can achieve between 15-25 bonds and de-bonds per hour.
활성 등재물
1
서비스
검사, 보험, 감정, 물류