Applied Materials is committed to accelerating this new PPACt playbook for our customers and partners. We have the broadest and deepest portfolio of products for delivering PPACt innovations to the market. This portfolio encompasses the ability to create and deposit, shape and remove, modify, analyze, and connect materials and devices in new ways. We are unique in having a broad suite of process technology and metrology capabilities under one roof, and we have highly differentiated silicon and packaging lab capabilities. Our Integrated Materials Solutions co-optimize materials deposition, removal, modification, and analysis to create new materials and engineer new structures for high-performance, low-power chips at leading-edge nodes.

APPLIED MATERIALS (AMAT)

VeritySEM 6i

The Applied VeritySEM Metrology system offers industry-leading precision and high production throughput for CD-SEM measurements. It provides 3Å precision for 45nm gate and ArF resist features, meeting the requirements of 45nm device production. The system's high throughput, automation, and tool matching capabilities minimize the need for operators and reduce the number of CD-SEM tools per fab, resulting in increased productivity and reduced capital investment.

One of its latest features, OPC Check, automates the OPC mask qualification process, ensuring the accuracy of printed features on the wafer. The VeritySEM utilizes proprietary SEM technology with faster electron movement, creating a narrow beam and small spot size for high resolution and precise metrology. Advanced scanning methods and pattern recognition algorithms enable angstrom level precision. Flexible beam currents improve signal-to-noise ratio, enhancing pattern recognition and increasing throughput.
One of its latest features, OPC Check, automates the OPC mask qualification process, ensuring the accuracy of printed features on the wafer. The VeritySEM utilizes proprietary SEM technology with faster electron movement, creating a narrow beam and small spot size for high resolution and precise metrology. Advanced scanning methods and pattern recognition algorithms enable angstrom level precision. Flexible beam currents improve signal-to-noise ratio, enhancing pattern recognition and increasing throughput.One of the latest advances on VeritySEM is the OPC Check, the industry’s only solution to automate the OPC (Optical Proximity Correction) mask qualification process. As chipmakers advance into 65nm technology node and beyond, OPC-enhanced features are commonly incorporated into mask design of all layers. Hundreds of CD measurements are then required to verify that the features printed on the wafer are indeed what the device designers intended to produce. With a suite of proprietary algorithms, OPC Check gets input from EDA design systems, automatically creates CD-SEM measurement recipes, then direct VeritySEM to measure thousands of sites in high throughput without operator assistance.

With proprietary SEM technology, electrons in the VeritySEM column move 50% faster than before, creating a narrow beam and small spot size that resulted in high resolution and tight ArF metrology. Innovative scanning method and advanced pattern recognition algorithms built into the VeritySEM enable angstrom level precision. Flexible beam currents provide a better signal-to-noise ratio, enabling faster, more robust pattern recognition and, ultimately, increased throughput.

"For cost-conscious 300mm fab manufacturers, high precision and productivity are a winning combination," said Dr. Gilad Almogy, vice president and general manager of the Process Diagnostics and Control product business group. "Field tests of the VeritySEM consistently show high throughput in real production environments. Our customers are finding that almost 35% fewer VeritySEM tools are needed to achieve the same output than other CD-SEM tools. This translates into one-third less cost of ownership than any other CD-SEM tool on the market," adds Almogy.

"The Applied VeritySEM Metrology system offers industry-leading precision and high production throughput for CD-SEM measurements. It provides 3Å precision for 45nm gate and ArF resist features, meeting the requirements of 45nm device production. The system's high throughput, automation, and tool matching capabilities minimize the need for operators and reduce the number of CD-SEM tools per fab, resulting in increased productivity and reduced capital investment.

One of its latest features, OPC Check, automates the OPC mask qualification process, ensuring the accuracy of printed features on the wafer. The VeritySEM utilizes proprietary SEM technology with faster electron movement, creating a narrow beam and small spot size for high resolution and precise metrology. Advanced scanning methods and pattern recognition algorithms enable angstrom level precision. Flexible beam currents improve signal-to-noise ratio, enhancing pattern recognition and increasing throughput."

VeritySEM

The Applied VeritySEM® 10 CD-SEM metrology platform is specifically designed to measure the critical dimensions of features patterned with EUV and high-NA EUV. The system uses industry-leading sub-nanometer eBeam resolution to quickly capture between 13 and 36 precise CD measurements across the wafer. The increased resolution and scan rate enable faster EUV scanner calibration which helps customers accelerate process recipe development, maximize yield in HVM, and increase ROI from their large lithography module investment. Low landing energy is used to minimize interaction with the thinner and more delicate photoresists of EUV and high-NA EUV in order to preserve pattern fidelity while maintaining tight metrology production requirements. 

VeritySEM 10 also brings enhancements to gate-all-around (GAA) transistors and 3D NAND memory metrology. Leading back-scattered electron (BSE) technology with a new detector architecture is used for 3D metrology and the extremely high aspect ratio features of GAA, enabling up to 50% tighter matching and higher resolution eTilt imaging. 3D NAND devices with increasing staircase interconnects can take advantage of specially-optimized working points with efficient secondary electron (SE) collection and advanced algorithms that increase the accuracy and robustness when imaging the CDs at the bottom of these deep structures. Additionally, a large field of view (LFOV) image generation capability combined with higher depth of focus permit complete 3D NAND staircase metrology with tighter matching and precision. 

VeritySEM 10

in-line 3D CD SEM metrology system for volume production of advanced 3D devices. Proprietary electron-filtering technology for high-aspect-ratio imaging, coupled with high resolution and tilted electron beam enable in-line 3D metrology

VeritySEM 5i

The 7830Si CD-SEM (Critical Dimension Scanning Electron Microscope) is a system that provides fully automated measurement of critical dimensions in wafer fabrication. It combines production-proven automation and advanced metrology with new imaging technology to allow accurate and repeatable measurement for process geometries down to 0.18µm design rules. The 7830Si has a new high aspect ratio (HAR) detector for high-resolution imaging of the bottom of deep contact holes or other features. Additionally, the 7830Si includes advanced features such as automatic defect review and engineering modes for process verification. This makes it a powerful tool for ensuring the accuracy and precision of wafer fabrication processes.

7830Si

VeritySEM 6C

RETicleSEM

NANOSEM


The Applied Materials VeritySEM 7i is a scanning electron microscope (SEM) system manufactured by Applied Materials, Inc. It is designed for high-resolution imaging and analysis of various materials in the semiconductor industry and other research fields. 

VeritySEM 7i

The Applied VeritySEM 3 Metrology system stands out with unparalleled precision, efficiently measuring 45nm gate features with a 3Å accuracy vital for 45nm device manufacturing. It boosts productivity and cost-effectiveness through advanced automation and precise tool matching, reducing reliance on operators and CD-SEM tools. The system's automated OPC Check feature, essential for integrating OPC designs beyond the 65nm tech node, employs proprietary algorithms for swift, manual-free measurements across numerous sites. Further, the enhanced OPC Check through Edge Contour Extraction offers improved modeling predictability by accurately integrating SEM contours with design intentions. With its state-of-the-art SEM technology, VeritySEM 3 ensures a sharp beam, superior ArF metrology resolution, and accelerated pattern recognition, elevating overall throughput.

VeritySEM 3

The Applied VeritySEM 2 Metrology system offers unparalleled precision and maximum production throughput, measuring 45nm gate, low-k, and ArF resist features with 3Å accuracy, essential for 45nm device production. Enhanced by its advanced automation, this system drastically reduces the need for tool operators and cuts down on CD-SEM tools in fabs. A standout feature, the OPC Check, automates the Optical Proximity Correction mask qualification, catering to evolving chipmaker needs. Proprietary SEM technology ensures speedy electron movement and precise measurements, resulting in top-notch resolution.

VeritySEM 2

The AMAT VeraSEM 3D is an advanced semiconductor imaging system introduced by Applied Materials. It offers three-dimensional imaging capabilities for chip features as small as 0.10 micron, allowing users to gain valuable insights into semiconductor structures with high precision. The system's enhanced efficiency makes it a powerful tool for semiconductor analysis and research.

VERASEM 3D

The Applied VeritySEM 4i+ metrology system uses proprietary SEM imaging technology to enable precise control of the lithography and etching processes, measuring CDs at a precision of less than 0.3nm. Applied’s OPC Check software for the VeritySEM system performs automated qualification of OPC-based (optical proximity correction) chip designs, significantly reducing mask verification time over conventional manual methods.

VeritySEM 4i+

Introduced in fiscal 2002, the NanoSEM 3D system extends CD-SEM technology beyond the measurement of critical dimensions to enable the three-dimensional imaging of chip features to more precisely control their lithography and etch processes.

NANOSEM 3D

Opal 7830i

OPAL 7830

The Applied VeritySEM4i, designed for sub-32nm metrology by Applied Materials, boasts a remarkable 1.5nm SEM resolution, optimal detection efficiency, and powerful image processing. The system highlights Fleet Matching with 0.3nm precision, and with its advanced SEM column design and algorithms, it tackles challenges like ArF resist shrinkage and SADP metrology. VeritySEM4i maximizes throughput, offers Å-level matching accuracy, and diminishes the need for multiple CD-SEM tools in fabs, resulting in boosted productivity and cost savings. Additionally, features like the Offline Recipe Generator streamline recipe creation, while OPC|CheckMax facilitates the automation of the OPC mask qualification process for sub-32nm chipmakers. Ultimately, VeritySEM4i encapsulates Applied Materials' vision to consistently innovate in the metrology and inspection industry.

VeritySEM 4i

VeraSEM™ is a metrology-SEM system that is the first of its kind in the industry. It extends the capabilities of a conventional CD-SEM system beyond just critical dimensional (CD) measurement, allowing for the monitoring of a variety of challenging process parameters. This means that VeraSEM™ provides a more comprehensive and versatile solution for process monitoring, making it a valuable tool for industries that require precise and accurate measurements.

6" Fab For Sale from Moov - Click Here to Learn More

6" Fab For Sale from Moov - Click Here to Learn More

6" Fab For Sale from Moov - Click Here to Learn More

APPLIED MATERIALS (AMAT)

개요

활성 등재물

총 제품 수

서비스

상위 APPLIED MATERIALS (AMAT) CD-SEM

VeritySEM 7i

VeritySEM 3

VeritySEM

VeritySEM 10

Moov에 등재하고 즉시 완벽한 구매자를 찾으십시오.

모든 APPLIED MATERIALS (AMAT) CD-SEM