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DISCO DFP8141
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    OEM 모델 설명
    CMP polisher designed to process hard-to-process materials such as sapphire and SiC Φ200 mm 1 axis, 2 chuck tables Wafer Thinning Stress Releaf Fully automatic operation The DFP8141 is a fully automatic polisher which performs CMP processing from cassette to cassette. With the installation of a cleaning station, wafer cleaning and drying after processing are performed automatically. For small workpieces made of difficult-to-process materials The DFP8141 supports CMP for materials such as sapphire, SiC, LT, and LN.
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    검증됨

    카테고리
    CMP

    마지막 검증일: 60일 이상 전

    주요 품목 세부 정보

    조건:

    Used


    작동 상태:

    알 수 없음


    제품 ID:

    112290


    웨이퍼 사이즈:

    알 수 없음


    빈티지:

    2023


    Have Additional Questions?
    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available

    DISCO

    DFP8141

    verified-listing-icon
    검증됨
    카테고리
    CMP
    마지막 검증일: 60일 이상 전
    listing-photo-e5cd4e2ecb29487a9c6a9476b553c8c5-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/1462/e5cd4e2ecb29487a9c6a9476b553c8c5/49212bf109974ae3938bc87dbf291a06_screenshot20240902at3_mw.png
    listing-photo-e5cd4e2ecb29487a9c6a9476b553c8c5-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/1462/e5cd4e2ecb29487a9c6a9476b553c8c5/a0090fd10e924898a34c080944707abd_screenshot20240902at3_mw.png
    listing-photo-e5cd4e2ecb29487a9c6a9476b553c8c5-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/1462/e5cd4e2ecb29487a9c6a9476b553c8c5/4d8f40506fd943bc83df46cbd8262bd4_screenshot20240902at3_mw.png
    주요 품목 세부 정보

    조건:

    Used


    작동 상태:

    알 수 없음


    제품 ID:

    112290


    웨이퍼 사이즈:

    알 수 없음


    빈티지:

    2023


    Have Additional Questions?
    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    설명
    설명 없음
    환경 설정
    환경 설정 없음
    OEM 모델 설명
    CMP polisher designed to process hard-to-process materials such as sapphire and SiC Φ200 mm 1 axis, 2 chuck tables Wafer Thinning Stress Releaf Fully automatic operation The DFP8141 is a fully automatic polisher which performs CMP processing from cassette to cassette. With the installation of a cleaning station, wafer cleaning and drying after processing are performed automatically. For small workpieces made of difficult-to-process materials The DFP8141 supports CMP for materials such as sapphire, SiC, LT, and LN.
    문서

    문서 없음