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설명
wet cleaning of debonded thin wafer on tape-frame / carrier wafer환경 설정
환경 설정 없음OEM 모델 설명
SUSS MicroTec’s semi-automated wet-processing system SD12 offers superior cleaning and lift-off functions for solvent media applications. The single-wafer processing platform serves pieces, wafer sizes up to 300 mm, square substrates up to 230 x 230 mm and tape frames for wafers up to 300 mm. Its ability to handle various media and processes gives the flexibility needed for switching between applications and makes the tool first choice for research environment and small scale production.문서
문서 없음
카테고리
Coaters & Developers
마지막 검증일: 60일 이상 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
103670
웨이퍼 사이즈:
알 수 없음
빈티지:
2022
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
SUSS MicroTec / KARL SUSS
SD12
카테고리
Coaters & Developers
마지막 검증일: 60일 이상 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
103670
웨이퍼 사이즈:
알 수 없음
빈티지:
2022
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
설명
wet cleaning of debonded thin wafer on tape-frame / carrier wafer환경 설정
환경 설정 없음OEM 모델 설명
SUSS MicroTec’s semi-automated wet-processing system SD12 offers superior cleaning and lift-off functions for solvent media applications. The single-wafer processing platform serves pieces, wafer sizes up to 300 mm, square substrates up to 230 x 230 mm and tape frames for wafers up to 300 mm. Its ability to handle various media and processes gives the flexibility needed for switching between applications and makes the tool first choice for research environment and small scale production.문서
문서 없음