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INOVA 3D
카테고리
CVD개요
In 2010, Novellus introduced a new version of the INOVA designed for copper barrier-seed applications in TSVs. The IONFLO copper seed in the INOVA 3D enables a four times reduction in the seed thickness required in a 6 micron by 60 micron TSV, significantly reducing the manufacturing cost.
활성 등재물
0
서비스
검사, 보험, 감정, 물류
상위 등재물
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