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Chemical vapor deposition (CVD) system designed for tungsten (W) and tungsten silicide (WSi) processes on 200-mm wafers. It features two process chambers and is optimized for electrode and wiring manufacturing. The system employs a ramp heating method, allowing it to accommodate products requiring different temperature zones, making it suitable for low-volume, multi-product manufacturing. Additionally, it utilizes plasma-free dry cleaning with chlorine trifluoride (ClF₃), which extends wet cleaning cycles and reduces running costs.
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검사, 보험, 감정, 물류