TS9000
개요
The system accurately analyzes the wiring quality of various leading-edge semiconductor packages such as Flip Chip BGA, wafer level packages, and 2.5D/3D ICs using terahertz technology. It is a TDR analysis system that has the world’s top-class signal quality.
활성 등재물
0
서비스
검사, 보험, 감정, 물류
상위 등재물
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