We value your privacy
We and our selected partners use cookies to enhance your browsing experience, serve personalized content, and analyze our traffic. By clicking "Accept All", you consent to our use of cookies. 더 알아보기
AXP 2.0-DFP2
개요
The AXP 2.0 Thermal Warpage System with Second Generation Digital Fringe Projection Vision Technology (AXP 2.0-DFP2) uses the Digital Fringe Projection 2 technique to measure a field of view up to 240mm x 192mm and down to 45mm x 36mm, with a measurement resolution down to 2.5 microns and 18 micron pixel sizes. This technique is particularly useful for measurement of connectors, sockets, BGA balls, and assembled modules, or any products with a discontinuous surface and varying step heights.
활성 등재물
0
서비스
검사, 보험, 감정, 물류
상위 등재물
- 제품을 찾을 수 없음