CI-T130S
개요
The ICOS CI-T120S and ICOS CI-T130S systems offer 2D and 3D metrology and inspection for Flip-Chip packaging, combining bump inspection, substrate top and bottom surface inspection and substrate warpage inspection in one system.
활성 등재물
0
서비스
검사, 보험, 감정, 물류
상위 등재물
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