설명
Film Thickness Measurement System환경 설정
환경 설정 없음OEM 모델 설명
SpectraFx 100 is KLA-Tencor’s next-gen thin film metrology solution that meets the process control requirements for 90nm devices, including 193nm DUV lithography processes. It supports next-gen and “operator-free” 300mm fabs with advanced automation and tool-to-tool matching capabilities, reducing process development time for advanced materials and accelerating their adoption into volume production. It also enables extensive product wafer monitoring and characterization required to accurately measure advanced thin films. It fully supports SEMI requirements for communication to automation tracks and materials process flow, delivering the precision, stability, and matching required for advanced thin film-measurement applications for 90nm device production. It achieves exceptional tool-to-tool matching and enables the use of a small spot size on product wafers, eliminating the use of monitor wafers.문서
문서 없음
KLA
SPECTRAFX 100
검증됨
카테고리
Defect Inspection
마지막 검증일: 17일 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
106457
웨이퍼 사이즈:
12"/300mm
빈티지:
알 수 없음
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
KLA
SPECTRAFX 100
카테고리
Defect Inspection
마지막 검증일: 17일 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
106457
웨이퍼 사이즈:
12"/300mm
빈티지:
알 수 없음
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
설명
Film Thickness Measurement System환경 설정
환경 설정 없음OEM 모델 설명
SpectraFx 100 is KLA-Tencor’s next-gen thin film metrology solution that meets the process control requirements for 90nm devices, including 193nm DUV lithography processes. It supports next-gen and “operator-free” 300mm fabs with advanced automation and tool-to-tool matching capabilities, reducing process development time for advanced materials and accelerating their adoption into volume production. It also enables extensive product wafer monitoring and characterization required to accurately measure advanced thin films. It fully supports SEMI requirements for communication to automation tracks and materials process flow, delivering the precision, stability, and matching required for advanced thin film-measurement applications for 90nm device production. It achieves exceptional tool-to-tool matching and enables the use of a small spot size on product wafers, eliminating the use of monitor wafers.문서
문서 없음