설명
KLA2365 Lamp환경 설정
11471781OEM 모델 설명
The KLA / TENCOR 2365 is a high resolution imaging system that can be used in 200mm and 300mm fabs. Applications include ritical etch, critical CMP, photo, and engineering analysis. It is particularly ideal for EOL metal etch and copper CMP layers. The KLA/TENCOR 2365 prober uses UV and visible light source and 0.12-mm pixel size for improved inspection sensitivity for 65-nm node and below design rules. In 2004, KLA introduced our latest generation ultraviolet (“UV”)-based high-resolution imaging inspection system, the 2365, which incorporates multiple-bandwidth brightfield illumination and other enhancements to extend the performance of the 2xxx series to the 90-nm node and below.문서
문서 없음
KLA
2365
검증됨
카테고리
Defect Inspection
마지막 검증일: 30일 이상 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
101317
웨이퍼 사이즈:
8"/200mm, 12"/300mm
빈티지:
알 수 없음
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
유사 등재물
모두 보기유사 등재물 없음
KLA
2365
카테고리
Defect Inspection
마지막 검증일: 30일 이상 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
101317
웨이퍼 사이즈:
8"/200mm, 12"/300mm
빈티지:
알 수 없음
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
설명
KLA2365 Lamp환경 설정
11471781OEM 모델 설명
The KLA / TENCOR 2365 is a high resolution imaging system that can be used in 200mm and 300mm fabs. Applications include ritical etch, critical CMP, photo, and engineering analysis. It is particularly ideal for EOL metal etch and copper CMP layers. The KLA/TENCOR 2365 prober uses UV and visible light source and 0.12-mm pixel size for improved inspection sensitivity for 65-nm node and below design rules. In 2004, KLA introduced our latest generation ultraviolet (“UV”)-based high-resolution imaging inspection system, the 2365, which incorporates multiple-bandwidth brightfield illumination and other enhancements to extend the performance of the 2xxx series to the 90-nm node and below.문서
문서 없음
유사 등재물
모두 보기유사 등재물 없음