중고 KLA PUMA 9130 판매

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환경 설정

Process: DKFLDINSP Tool config is based on original PO, please verify tool details at tool inspection SW: 9.3.309.2.4 Wafer Size 300 mm (12”) Carrier Wafer calibration kit incl. DSW & Shiny Carrier I.D. HW options Hermos (2 CID devices) Advantag (2 CID devices) Keyence BCR SingleWire (2 CID devices) Interlocks Safety Interlock for open panel Safety Interlock for laser Facilities Power: 2V5W-N, 18KW Vw:28 in Hg CDA:7 Sft3/min P-N2:0.36 Sft3/min Exhaust:1300 ft3/min Exhaust:600 ft3/min Exhaust:325 ft3/min Integrated Mini-Environment. Included FEC computer system with the following minimum features: Intel®Pentium®4 CPU 504 MB memory (RAM) DELL computer system with the following minimum features Intel®Xeon™ CPU 256 MB memory (RAM) VCD - ROM mouse HSMS / GEM SEMI E37 compliant Ethernet interface HSMS (E5 / E30 / E37) GEM/SECS Automation Interface (E4 / E5 / E30) SEMI E84 SEMI E116 Hokuyo Sensors for use with: Overhead Transport (OHT) Remote Guided Vehicles (RGV/AGV) Auto Switch for Dual Use Environments Basic Automation Package – E39, E87, E90 (Carrier Management/Wafer Tracking) Advanced Automation Package E40, E94 (Process Job, Control Job) Software Modular Inspection Station Software v9.3 Sensitivity Tuner Fast Algorithm Inline Defect Organizer (iDO) Software Feature Options Array Mode Algorithm Sizing 9.3 Simulator RICO Capable iDM Satellite ADC Manager 3.6 YMS Options UDB/Klarity Interface Data Transfer DVD-R Ethernet Hardware optic Stand alone User Interface 2 x Darkfield Sensor 1 x Normal Sensor Common Pixel Package: sL20, sL40, sL60 Enhanced Throughput Package (TP1)a: sL15, sL10 Additional Pixel Option sL70b Internal Review Microscope 5 Objectives (5x, 10x, 50x, 100x, 150x) Brightfield / darkfield viewing Autofocus capability Low Contact Chuck Integrated ULPA Filter Laser Chiller Earthquake Restraint Power Line Conditioner Remote Power Line Conditioner Remote Power EMO Remote Blower Option Remote Chiller Option Mounting Ballroom Signal Light Tower External Blower Damage/Missing parts list Dry pumps are not included with sales Please inspect tool to reconfirm

OEM 모델 설명

The Puma 9130 is a Laser Imaging Patterned Wafer Inspection System that combines UV illumination optics with multiple high-speed imaging sensors to offer a range of optical modes for critical defect detection inline on patterned, production wafers1. It delivers high sampling rates, high throughput, and high sensitivity enabling more effective capture and control of yield-impacting defects on critical front-end-of-line (FEOL) and back-end-of-line (BEOL) layers1. The Puma 9130 provides oblique UV illumination while the 9150 also offers an additional, normal illumination mode. Both tools provide three illumination polarizations (S, P, C) and independently configured collection polarization filters (S, P, None) for each of the three channels.