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설명
설명 없음환경 설정
환경 설정 없음OEM 모델 설명
The F30™ System is an advanced inspection tool designed to blur the lines between dark field micro inspection and traditional macro inspection. It provides automated defect inspection for front-end and outgoing quality (OQA) applications. The system boasts a five-objective turret that enables the resolution-throughput flexibility required by today’s multi-process inspection applications. Equipped with an advanced productivity suite, the F30 System redefines inspection cost of ownership expectations. It has a throughput of up to 120 wph (10µm) and resolution flexibility (10µm to 0.5µm). It also has three simultaneous color defect review methods: on-the-fly, high resolution, whole wafer. The F30 System is suitable for a variety of applications including After develop inspection (ADI), Fab Outgoing QA, Post CMP inspection, and After etch inspection. It can also team with edge and backside modules for an all-surface solution.문서
문서 없음
카테고리
Defect Inspection
마지막 검증일: 60일 이상 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
128740
웨이퍼 사이즈:
알 수 없음
빈티지:
알 수 없음
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
ONTO / RUDOLPH / AUGUST
F30
카테고리
Defect Inspection
마지막 검증일: 60일 이상 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
128740
웨이퍼 사이즈:
알 수 없음
빈티지:
알 수 없음
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
설명
설명 없음환경 설정
환경 설정 없음OEM 모델 설명
The F30™ System is an advanced inspection tool designed to blur the lines between dark field micro inspection and traditional macro inspection. It provides automated defect inspection for front-end and outgoing quality (OQA) applications. The system boasts a five-objective turret that enables the resolution-throughput flexibility required by today’s multi-process inspection applications. Equipped with an advanced productivity suite, the F30 System redefines inspection cost of ownership expectations. It has a throughput of up to 120 wph (10µm) and resolution flexibility (10µm to 0.5µm). It also has three simultaneous color defect review methods: on-the-fly, high resolution, whole wafer. The F30 System is suitable for a variety of applications including After develop inspection (ADI), Fab Outgoing QA, Post CMP inspection, and After etch inspection. It can also team with edge and backside modules for an all-surface solution.문서
문서 없음