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No Missing Parts환경 설정
NSX330 mWL 200 F30 Combo(Robot) NSX330 1340Lx1100Wx2090H mm mWL 200 F30 Combo 1677Lx1760Wx2055H mmOEM 모델 설명
The NSX 330 System is an advanced packaging system that improves cost of ownership by enabling multiple applications in a single platform. It combines inspection and metrology to measure multiple applications, including wafer-level metrology for micro bumps, RDL, kerf, overlay, and through silicon via (TSV) in a single wafer load. The system offers robust platform technology and is suitable for a wide range of applications. It also offers a choice of inspection platforms with hard-anodized finish which can accommodate 100mm to 330mm whole wafers and features programmable light tower, programmable illumination filter wheel, multiple modes of dark field illumination, standard docking module, resolution flexibility (10µm to 0.5µm), three simultaneous color defect review methods: on-the-fly, high resolution, whole wafer. It teams with edge and backside modules for all-surface solution and offers unique handling solutions (Mems, Taiko, Thin), extreme warpage (>12mm) and ultra-thin (<50µm). The system also supports tool matching, recipe sharing, recipe server, Discover® Software database results archiving, offline inspection and metrology engineering clients as well as offline defect review clients.문서
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ONTO / RUDOLPH / AUGUST
NSX-330
검증됨
카테고리
Defect Inspection
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
101113
웨이퍼 사이즈:
알 수 없음
빈티지:
2019
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
유사 등재물
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ONTO / RUDOLPH / AUGUST
NSX-330
검증됨
카테고리
Defect Inspection
마지막 검증일: 30일 이상 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
101113
웨이퍼 사이즈:
알 수 없음
빈티지:
2019
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
설명
No Missing Parts환경 설정
NSX330 mWL 200 F30 Combo(Robot) NSX330 1340Lx1100Wx2090H mm mWL 200 F30 Combo 1677Lx1760Wx2055H mmOEM 모델 설명
The NSX 330 System is an advanced packaging system that improves cost of ownership by enabling multiple applications in a single platform. It combines inspection and metrology to measure multiple applications, including wafer-level metrology for micro bumps, RDL, kerf, overlay, and through silicon via (TSV) in a single wafer load. The system offers robust platform technology and is suitable for a wide range of applications. It also offers a choice of inspection platforms with hard-anodized finish which can accommodate 100mm to 330mm whole wafers and features programmable light tower, programmable illumination filter wheel, multiple modes of dark field illumination, standard docking module, resolution flexibility (10µm to 0.5µm), three simultaneous color defect review methods: on-the-fly, high resolution, whole wafer. It teams with edge and backside modules for all-surface solution and offers unique handling solutions (Mems, Taiko, Thin), extreme warpage (>12mm) and ultra-thin (<50µm). The system also supports tool matching, recipe sharing, recipe server, Discover® Software database results archiving, offline inspection and metrology engineering clients as well as offline defect review clients.문서
문서 없음