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RUDOLPH / RVSI WS-3880
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    환경 설정
    Currently Configured for 300mm wafer size MFG Date: Dec 2012 EQUIPMENT DETAILS: Bump inspection system, 12" XPort, wafer scanner, ISO class 1 EFEM Outfitted with a dual arm robot XPort capable of handling: Standard wafer thicknesses (725um) down to 400 micron thickness for 12" wafers Standard features: Automated whole wafer handling Dual arm vacuum assist backside wafer handling End effector Integrated laminar clean air flow mini-environment (ULPA Filtration) Robot with integrated mapper Brooks Vision loadports, ATR9100, w/o Mapping Brooks Vision 12" load ports Capabilities: Local LCD user interface (30) Predefined fab specific indicators, labels, and buttons Customized indicator, labels, and buttons E84 OHT ready E99 carrier ID ready Class 3B laser at 830nm wavelength for 3D measurement. 3D sensor assy / computer, 5um / 8MHz, WS3880 Standard, 3D height verif wafer, 24um, 12" Ringlight assy, 3.5mm clearance Objective, 20x, long working dist, LMPLFL20XBD Dual OCR, Xport Ionizer assy, 44" Aerobar, XPort Clean air supply ionizer (AXi/XPort) Bar code reader, UPH and XPort, USB Computer, remote defect review
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    RUDOLPH / RVSI

    WS-3880

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    Defect Inspection
    마지막 검증일: 60일 이상 전
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    Used


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    제품 ID:

    19724


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    RUDOLPH / RVSI WS-3880
    RUDOLPH / RVSIWS-3880Defect Inspection
    빈티지: 0조건: 중고
    마지막 검증일6일 전

    RUDOLPH / RVSI

    WS-3880

    verified-listing-icon

    검증됨

    카테고리

    Defect Inspection
    마지막 검증일: 60일 이상 전
    listing-photo-ogWWaqpLAMANqK61Ch1LhYSc78JOimUaIK7f4mz8GRo-https://d2pkkbyngq3xpw.cloudfront.net/moov_media/3.0-assets/photo-coming-soon-small.png
    주요 품목 세부 정보

    조건:

    Used


    작동 상태:

    알 수 없음


    제품 ID:

    19724


    웨이퍼 사이즈:

    알 수 없음


    빈티지:

    알 수 없음


    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    설명
    설명 없음
    환경 설정
    Currently Configured for 300mm wafer size MFG Date: Dec 2012 EQUIPMENT DETAILS: Bump inspection system, 12" XPort, wafer scanner, ISO class 1 EFEM Outfitted with a dual arm robot XPort capable of handling: Standard wafer thicknesses (725um) down to 400 micron thickness for 12" wafers Standard features: Automated whole wafer handling Dual arm vacuum assist backside wafer handling End effector Integrated laminar clean air flow mini-environment (ULPA Filtration) Robot with integrated mapper Brooks Vision loadports, ATR9100, w/o Mapping Brooks Vision 12" load ports Capabilities: Local LCD user interface (30) Predefined fab specific indicators, labels, and buttons Customized indicator, labels, and buttons E84 OHT ready E99 carrier ID ready Class 3B laser at 830nm wavelength for 3D measurement. 3D sensor assy / computer, 5um / 8MHz, WS3880 Standard, 3D height verif wafer, 24um, 12" Ringlight assy, 3.5mm clearance Objective, 20x, long working dist, LMPLFL20XBD Dual OCR, Xport Ionizer assy, 44" Aerobar, XPort Clean air supply ionizer (AXi/XPort) Bar code reader, UPH and XPort, USB Computer, remote defect review
    OEM 모델 설명
    미제공
    문서

    문서 없음

    유사 등재물
    모두 보기
    RUDOLPH / RVSI WS-3880
    RUDOLPH / RVSI
    WS-3880
    Defect Inspection빈티지: 0조건: 중고마지막 검증일: 6일 전
    RUDOLPH / RVSI WS-3880
    RUDOLPH / RVSI
    WS-3880
    Defect Inspection빈티지: 0조건: 중고마지막 검증일: 60일 이상 전