설명
설명 없음환경 설정
Currently Configured for 300mm wafer size MFG Date: Dec 2012 EQUIPMENT DETAILS: Bump inspection system, 12" XPort, wafer scanner, ISO class 1 EFEM Outfitted with a dual arm robot XPort capable of handling: Standard wafer thicknesses (725um) down to 400 micron thickness for 12" wafers Standard features: Automated whole wafer handling Dual arm vacuum assist backside wafer handling End effector Integrated laminar clean air flow mini-environment (ULPA Filtration) Robot with integrated mapper Brooks Vision loadports, ATR9100, w/o Mapping Brooks Vision 12" load ports Capabilities: Local LCD user interface (30) Predefined fab specific indicators, labels, and buttons Customized indicator, labels, and buttons E84 OHT ready E99 carrier ID ready Class 3B laser at 830nm wavelength for 3D measurement. 3D sensor assy / computer, 5um / 8MHz, WS3880 Standard, 3D height verif wafer, 24um, 12" Ringlight assy, 3.5mm clearance Objective, 20x, long working dist, LMPLFL20XBD Dual OCR, Xport Ionizer assy, 44" Aerobar, XPort Clean air supply ionizer (AXi/XPort) Bar code reader, UPH and XPort, USB Computer, remote defect reviewOEM 모델 설명
미제공문서
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RUDOLPH / RVSI
WS-3880
검증됨
카테고리
Defect Inspection
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
19724
웨이퍼 사이즈:
알 수 없음
빈티지:
알 수 없음
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
유사 등재물
모두 보기RUDOLPH / RVSI
WS-3880
검증됨
카테고리
Defect Inspection
마지막 검증일: 60일 이상 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
19724
웨이퍼 사이즈:
알 수 없음
빈티지:
알 수 없음
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
설명
설명 없음환경 설정
Currently Configured for 300mm wafer size MFG Date: Dec 2012 EQUIPMENT DETAILS: Bump inspection system, 12" XPort, wafer scanner, ISO class 1 EFEM Outfitted with a dual arm robot XPort capable of handling: Standard wafer thicknesses (725um) down to 400 micron thickness for 12" wafers Standard features: Automated whole wafer handling Dual arm vacuum assist backside wafer handling End effector Integrated laminar clean air flow mini-environment (ULPA Filtration) Robot with integrated mapper Brooks Vision loadports, ATR9100, w/o Mapping Brooks Vision 12" load ports Capabilities: Local LCD user interface (30) Predefined fab specific indicators, labels, and buttons Customized indicator, labels, and buttons E84 OHT ready E99 carrier ID ready Class 3B laser at 830nm wavelength for 3D measurement. 3D sensor assy / computer, 5um / 8MHz, WS3880 Standard, 3D height verif wafer, 24um, 12" Ringlight assy, 3.5mm clearance Objective, 20x, long working dist, LMPLFL20XBD Dual OCR, Xport Ionizer assy, 44" Aerobar, XPort Clean air supply ionizer (AXi/XPort) Bar code reader, UPH and XPort, USB Computer, remote defect reviewOEM 모델 설명
미제공문서
문서 없음