In 2010, Novellus introduced a new version of the INOVA designed for copper barrier-seed applications in TSVs. The IONFLO copper seed in the INOVA 3D enables a four times reduction in the seed thickness required in a 6 micron by 60 micron TSV, significantly reducing the manufacturing cost.

Lam Research is a leading supplier of plasma etch- and single-wafer clean equipment that plays a pivotal role in defining the features and capabilities of next-generation semiconductor devices. With the addition of Novellus' innovative thin-film deposition and surface preparation product lines, the new Lam Research is well-positioned within the industry to support critical technology transitions including 3D structures in advanced logic and NAND memory, as well as the scaling to 450 mm wafers.

INOVA 3D

카테고리

개요

활성 등재물

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상위 등재물

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