설명
standard 12" wafe flip chip bonder configuration, conditional very good환경 설정
slot magazine (pick head )onload, flip chip module ,slot offload, standard configurationOEM 모델 설명
The ASM AD8312FC is an advanced Automatic Die Bonding System designed for handling 12-inch wafers. It offers the capability of direct die attach mode, in addition to the standard flip chip process. This system provides efficient and precise die bonding solutions, making it suitable for various semiconductor assembly applications, including direct die attach processes for specific requirements.문서
문서 없음
ASM
AD8312FC
검증됨
카테고리
Die Bonders / Sorters / Attachers
마지막 검증일: 60일 이상 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
59681
웨이퍼 사이즈:
12"/300mm
빈티지:
2017
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
ASM
AD8312FC
카테고리
Die Bonders / Sorters / Attachers
마지막 검증일: 60일 이상 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
59681
웨이퍼 사이즈:
12"/300mm
빈티지:
2017
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
설명
standard 12" wafe flip chip bonder configuration, conditional very good환경 설정
slot magazine (pick head )onload, flip chip module ,slot offload, standard configurationOEM 모델 설명
The ASM AD8312FC is an advanced Automatic Die Bonding System designed for handling 12-inch wafers. It offers the capability of direct die attach mode, in addition to the standard flip chip process. This system provides efficient and precise die bonding solutions, making it suitable for various semiconductor assembly applications, including direct die attach processes for specific requirements.문서
문서 없음