AD838P
개요
Automatic high precision epoxy die bonder High precision bonding performance on QFN, TQFP, PLCC, TSOP, SOIC, SOT etc.
활성 등재물
1
서비스
검사, 보험, 감정, 물류
Automatic high precision epoxy die bonder High precision bonding performance on QFN, TQFP, PLCC, TSOP, SOIC, SOT etc.
1
검사, 보험, 감정, 물류