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SD8312
개요
New generation SD8312 sets new industry record for 12” soft solder die bonding process High-density leadframe handling with universal workholder design High-speed performance combining proven technologies with high-tech innovations Sophisticated oxygen level control Capable of AB dice handling
활성 등재물
0
서비스
검사, 보험, 감정, 물류
상위 등재물
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