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6" Fab For Sale from Moov - Click Here to Learn More
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6" Fab For Sale from Moov - Click Here to Learn More
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2007 HS

개요

ESEC 2007 HS is a die attacher manufactured by ESEC. Die attach, also known as die mount or die bond, is the process of attaching a silicon chip to the die pad or die cavity of the support structure (e.g., the leadframe) of a semiconductor package. There are two common die attach processes: adhesive die attach and eutectic die attach. Both of these processes use special die attach equipment and tools to mount the die.

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