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설명
Esec Soft Solder > Not Installed Top Stock Module for LF handling but still included > with workholder for OMP1 > lacking 2 Monitors > with machine safety cover환경 설정
환경 설정 없음OEM 모델 설명
The ESEC 2009 SSIE is an advanced die bonder specifically designed to address the evolving demands of power die attach. Its exceptional productivity and precise process control set new industry standards. Utilizing patented soft solder process technologies, this die bonder ensures optimal results and helps maintain a leading market position. An outstanding feature of the ESEC 2009 SSIE is its capability to handle 300mm / 12" wafers, providing versatility and scalability for various applications.문서
문서 없음
카테고리
Die Bonders / Sorters / Attachers
마지막 검증일: 25일 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
123087
웨이퍼 사이즈:
알 수 없음
빈티지:
2011
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
유사 등재물
모두 보기
BESI / ESEC
2009 SSIE
카테고리
Die Bonders / Sorters / Attachers
마지막 검증일: 25일 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
123087
웨이퍼 사이즈:
알 수 없음
빈티지:
2011
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
설명
Esec Soft Solder > Not Installed Top Stock Module for LF handling but still included > with workholder for OMP1 > lacking 2 Monitors > with machine safety cover환경 설정
환경 설정 없음OEM 모델 설명
The ESEC 2009 SSIE is an advanced die bonder specifically designed to address the evolving demands of power die attach. Its exceptional productivity and precise process control set new industry standards. Utilizing patented soft solder process technologies, this die bonder ensures optimal results and helps maintain a leading market position. An outstanding feature of the ESEC 2009 SSIE is its capability to handle 300mm / 12" wafers, providing versatility and scalability for various applications.문서
문서 없음