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설명
No missing parts환경 설정
Single moduleOEM 모델 설명
The 2200 apm is a DC machine that offers trendsetting features such as an Automatic Wafer Changing System, Mapping Function, Automatic Tool Changing, and a Multi-Chip Ejector Carrousel System. It guarantees a placement accuracy of 10µm @ 3 sigma and can process multi-chip and multi-flip-chip applications optimally. The machine’s high accuracy is due to its automatic calibration system, new stronger machine casting, high-resolution image processing, servo motor for the theta axis, and linear motor for the x,y,z axis. It has many possible applications including FCOB, MCM, PBGA, FCBGA, COB, CSP, etc. The dipping unit allows coating of bumped chips with flux or other media and can dip up to 1" dice. The precision flip-mechanism picks up a chip from a wafer, flips it 180° and places it almost simultaneously on the substrate. The flexible gripper indexer automatically adjusts width to suit various lead frame dimensions and transports strips through the transport system with the aid of two simultaneously functioning pairs of grippers. The ATS permits the automatic transport of substrates, boats and carriers by means of flat belts and optical sensors.문서
문서 없음
PREFERRED
SELLER
카테고리
Die Bonders / Sorters / Attachers
마지막 검증일: 60일 이상 전
Buyer pays 12% premium of final sale price
주요 품목 세부 정보
조건:
Used
작동 상태:
Deinstalled
제품 ID:
105397
웨이퍼 사이즈:
알 수 없음
빈티지:
2004
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
유사 등재물
모두 보기
PREFERRED
SELLER
BESI / DATACON
2200 APM
카테고리
Die Bonders / Sorters / Attachers
마지막 검증일: 60일 이상 전
Buyer pays 12% premium of final sale price
주요 품목 세부 정보
조건:
Used
작동 상태:
Deinstalled
제품 ID:
105397
웨이퍼 사이즈:
알 수 없음
빈티지:
2004
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
설명
No missing parts환경 설정
Single moduleOEM 모델 설명
The 2200 apm is a DC machine that offers trendsetting features such as an Automatic Wafer Changing System, Mapping Function, Automatic Tool Changing, and a Multi-Chip Ejector Carrousel System. It guarantees a placement accuracy of 10µm @ 3 sigma and can process multi-chip and multi-flip-chip applications optimally. The machine’s high accuracy is due to its automatic calibration system, new stronger machine casting, high-resolution image processing, servo motor for the theta axis, and linear motor for the x,y,z axis. It has many possible applications including FCOB, MCM, PBGA, FCBGA, COB, CSP, etc. The dipping unit allows coating of bumped chips with flux or other media and can dip up to 1" dice. The precision flip-mechanism picks up a chip from a wafer, flips it 180° and places it almost simultaneously on the substrate. The flexible gripper indexer automatically adjusts width to suit various lead frame dimensions and transports strips through the transport system with the aid of two simultaneously functioning pairs of grippers. The ATS permits the automatic transport of substrates, boats and carriers by means of flat belts and optical sensors.문서
문서 없음