
설명
NEWPORT MRSI 705 Operational and in production Complete with no missing parts환경 설정
Magazine to Magazine. 4 stage ramp-up heating, Manual loading gelpak holder. Single Head, Gripper Type. High Bondforce capableOEM 모델 설명
The MRSI-705 5-Micron Die Bonder sets the mark for high-precision, high-speed component assembly. Engineered for manufacturing robustness, the MRSI-705 is a flexible configurable platform, with the largest installed base in the industry in advanced packaging. Applications are found across a wide range of market segments, such as life & health sciences, aerospace, defense, automotive, lighting, communications, and more. The MRSI-705 is built to meet the highest standards of reliability and dependability. It starts with an award-winning, industry standard platform with a day-in/day-out accuracy of 5 microns; achieved by leveraging the platform’s signature design features: -A solid granite platform supports the placement head from above, so that no mechanisms are cantilevered. All of this makes the MRSI-705 thermally and mechanically stable with extremely fast settling times and +/- 5 microns or better placement accuracy, a requirement for critical applications. -Minimized number of moving mechanical parts. -The major system X Y axes use zero force, ironless, actively cooled linear motors with high resolution linear encoders. Encoder scales have 0.1-micron resolution for fast, precise, closed-loop positioning. The linear motors deliver faster speeds (acceleration, deceleration and velocity), with better settling times and overall smoother motion. -Reliability is enhanced through the use of advanced air-bearing technology in the Z axis.문서
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유사 등재물
모두 보기NEWPORT
MRSI 705
카테고리
Die Bonders / Sorters / Attachers
마지막 검증일: 30일 이상 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
123098
웨이퍼 사이즈:
알 수 없음
빈티지:
2014
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설명
NEWPORT MRSI 705 Operational and in production Complete with no missing parts환경 설정
Magazine to Magazine. 4 stage ramp-up heating, Manual loading gelpak holder. Single Head, Gripper Type. High Bondforce capableOEM 모델 설명
The MRSI-705 5-Micron Die Bonder sets the mark for high-precision, high-speed component assembly. Engineered for manufacturing robustness, the MRSI-705 is a flexible configurable platform, with the largest installed base in the industry in advanced packaging. Applications are found across a wide range of market segments, such as life & health sciences, aerospace, defense, automotive, lighting, communications, and more. The MRSI-705 is built to meet the highest standards of reliability and dependability. It starts with an award-winning, industry standard platform with a day-in/day-out accuracy of 5 microns; achieved by leveraging the platform’s signature design features: -A solid granite platform supports the placement head from above, so that no mechanisms are cantilevered. All of this makes the MRSI-705 thermally and mechanically stable with extremely fast settling times and +/- 5 microns or better placement accuracy, a requirement for critical applications. -Minimized number of moving mechanical parts. -The major system X Y axes use zero force, ironless, actively cooled linear motors with high resolution linear encoders. Encoder scales have 0.1-micron resolution for fast, precise, closed-loop positioning. The linear motors deliver faster speeds (acceleration, deceleration and velocity), with better settling times and overall smoother motion. -Reliability is enhanced through the use of advanced air-bearing technology in the Z axis.문서
문서 없음