The ASM AD9312 is a cutting-edge wire bonder equipped with shared optics technology, enabling exceptional bonding accuracy. It incorporates intelligent bond head active tilting control and patented active vibration control to ensure high-quality bonding results with excellent coplanarity and stability.

ASM is a supplier of semiconductor process equipment for wafer processing, including lithography, deposition, ion implant and single-wafer epitaxy. ASM is part of the ASM International NV group that also includes ASM Pacific Technology (ASMPT). ASMPT, in which ASMI holds a substantial ownership is a leading supplier of semiconductor process equipment for wafer assembly and packaging, and for surface mount technology.



AD9312

카테고리

개요

활성 등재물

서비스

상위 등재물

Moov에 등재하고 즉시 완벽한 구매자를 찾으십시오.