We value your privacy
We and our selected partners use cookies to enhance your browsing experience, serve personalized content, and analyze our traffic. By clicking "Accept All", you consent to our use of cookies. 더 알아보기
TWIN832
개요
The Twin832 is a high speed epoxy die bonder equipped with an innovative dual patented bond head system. It is suitable for handling a large range of IC/discrete packages, especially SiP, for multi-chip bonding for standalone or in-line machines. High density lead-frames can be applied in the Twin832 as its large range of work-holder track width maximizes customer’s productivity at low production cost.
활성 등재물
4
서비스
검사, 보험, 감정, 물류
