개요

Reliable separation of small die wafers The DDS2010 offers an integrated expansion and breaking solution to achieve high-yield and high-throughput die singulation of wafers processed using Stealth Dicing™ process (SD)※. *Stealth Dicing™ is a processing method that focuses a laser within the workpiece to form a modified layer, after which a tape expander is used to separate the die. This processing method is effective in achieving street reduction for small die or rectangular-shaped die such as RFID ICs and line sensors.