IS868LA2
카테고리
Bonders개요
The ASM IS868LA2 is a die bonder machine used in the semiconductor industry for attaching semiconductor chips to a substrate
활성 등재물
5
서비스
검사, 보험, 감정, 물류
The ASM IS868LA2 is a die bonder machine used in the semiconductor industry for attaching semiconductor chips to a substrate
5
검사, 보험, 감정, 물류