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Applied Centris AdvantEdge Mesa Etch, the smartest, fastest silicon etch system made for the volume production of the world’s most advanced memory and logic chips. Featuring an unprecedented eight process chambers – six etch and two plasma clean chambers – the compact Centris system can process up to 180 wafers per hour, lowering the per-wafer cost by up to 30%. Proprietary system intelligence software assures every process on every chamber precisely matches, delivering angstrom-level uniformity on every wafer – a critical requirement for high yield in tomorrow’s highly-complex chip designs.