Applied Materials is committed to accelerating this new PPACt playbook for our customers and partners. We have the broadest and deepest portfolio of products for delivering PPACt innovations to the market. This portfolio encompasses the ability to create and deposit, shape and remove, modify, analyze, and connect materials and devices in new ways. We are unique in having a broad suite of process technology and metrology capabilities under one roof, and we have highly differentiated silicon and packaging lab capabilities. Our Integrated Materials Solutions co-optimize materials deposition, removal, modification, and analysis to create new materials and engineer new structures for high-performance, low-power chips at leading-edge nodes.

APPLIED MATERIALS (AMAT)

Applied Materials Centura Silvia Etch system is specifically designed for the challenging deep silicon etch required to create the vertical connections between the chips or wafers. It overcomes the tradeoff between profile control and high etch rate faced by conventional methods. The system’s high-density plasma source enables the highest silicon and oxide etch rates for all wafer-level packaging applications.

APPLIED MATERIALS (AMAT)

CENTURA Silvia Etch

Dry / Plasma Etch

유사 등재물

APPLIED MATERIALS (AMAT)

CENTURA Silvia Etch

APPLIED MATERIALS (AMAT)

CENTURA Silvia Etch

APPLIED MATERIALS (AMAT)

CENTURA Silvia Etch

CENTURA Silvia Etch

Dry / Plasma Etch

유사 등재물

APPLIED MATERIALS (AMAT)

CENTURA Silvia Etch

APPLIED MATERIALS (AMAT)

CENTURA Silvia Etch

APPLIED MATERIALS (AMAT)

CENTURA Silvia Etch