Details attached
PARTS: 		
Ring magnet upper	 - 0040-32463
Ring magnet lower	- 0040-32509
Insert slit valve x 2	- 0021-10693
Liner inner pump port - 0021-39942
Liner outer pump port - 0021-39943
Window EPD - 3440-01037
Source Si .243 thick - 0200-00295
Fore line valve	 - 090B001186
Roughing valve - 090B001185
Base plate W/baffle quartz - 0200-10555
Shield light pyrometer - 0200-10541
SiC Collar - 0200-10549
Liner lower TV - 0021-39971
Liner middle TV - 0021-39972
Blade TV	- 0040-32512
Liner upper TV - 0021-39935

GASBOX ABC			
1	N2	UNIT 1661	500
2	H2	UNIT 1661	270
3	CH2F2	AERA	100
4	C2F6	AERA	50
5	O2	AERA	1000
6	O2	AERA	51
7	C4F8	AERA	50
8	CHF3	AERA	50
9	CO2	AERA	200
10	AR	AERA	1000

GASBOX D			
31	C4F6	AERA	52
32	H2	AERA	50
34	N2	AERA	100
35	O2	AERA	1000
36	O2	AERA	50
37	C4F8	AERA	50
38	CHF3	AERA	100
39	CF4	AERA	100
40	AR	BROOKS NUM	1000

TURBO ABC			
SEIKO SEKI			STPA2203
TURBO D			
SEIKO SEKI			STPA1603C
BARATRON ABC			
MKS			627-1TAD
BARATRON D			
MKS			627-01TBC

amat_centura_spec.xlsx

Applied Materials is committed to accelerating this new PPACt playbook for our customers and partners. We have the broadest and deepest portfolio of products for delivering PPACt innovations to the market. This portfolio encompasses the ability to create and deposit, shape and remove, modify, analyze, and connect materials and devices in new ways. We are unique in having a broad suite of process technology and metrology capabilities under one roof, and we have highly differentiated silicon and packaging lab capabilities. Our Integrated Materials Solutions co-optimize materials deposition, removal, modification, and analysis to create new materials and engineer new structures for high-performance, low-power chips at leading-edge nodes.

APPLIED MATERIALS (AMAT)

Etch system delivers high-productivity silicon, metal, and dielectric etch.

The Centura and Centura AP mainframe single-wafer, multi-chamber architectures enable integrated, sequential wafer processing in up to four process chambers for 150mm, 200mm, and 300mm wafers.

For 150/200mm wafers, Applied Centura DPS® DTM system employs advanced deep reactive ion etch (DRIE) for a range of materials to precisely control etch wall smoothness and trench profile, while delivering high aspect ratio capability and achieving high throughput. Applied Centura DPS Plus is the industry standard for metal etch processes.

CENTURA 5200 IPS

D405BCFD-1F27-4D93-A141-681004E1AB83_1_105_c.jpeg

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CD920D82-696A-4B6E-A423-D75A70B3D552_1_105_c.jpeg

6DD11C06-77CD-4403-8AFB-265F5CD15B27_1_201_a.jpeg

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D18E5519-38BC-41F5-B638-EEACCF41B194_1_201_a.jpeg

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67B2C887-825C-434B-B8C6-AD4EE6A7A856_1_201_a.jpeg

B24EB642-F502-4917-BC0B-56F67F4A05A2_1_201_a.jpeg

APPLIED MATERIALS (AMAT)

CENTURA 5200 IPS

Dry / Plasma Etch

유사 등재물

CENTURA 5200 IPS

Dry / Plasma Etch

유사 등재물