설명
Polysilicon Etch환경 설정
2300e4 KIYO EXOEM 모델 설명
The 2300 Versys Kiyo is a manufacturing tool designed for 65 nm and beyond. It provides excellent uniformity and defect control on a reliable wafer transport system. The symmetric chamber and radial tuning features produce uniform etch results for advanced devices. It employs proprietary technology for process repeatability, low defect, and metal contamination results. It supports conventional applications such as gate and shallow trench isolation (STI) and emerging applications such as high k dielectric removal, critical spacer etch, and lithography-enabling etch steps. The system can be upgraded from the 2300 Versys Star, providing an investment-extending strategy.문서
문서 없음
카테고리
Dry / Plasma Etch
마지막 검증일: 14일 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
62711
웨이퍼 사이즈:
12"/300mm
빈티지:
알 수 없음
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
LAM RESEARCH CORPORATION
2300 VERSYS KIYO
카테고리
Dry / Plasma Etch
마지막 검증일: 14일 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
62711
웨이퍼 사이즈:
12"/300mm
빈티지:
알 수 없음
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
설명
Polysilicon Etch환경 설정
2300e4 KIYO EXOEM 모델 설명
The 2300 Versys Kiyo is a manufacturing tool designed for 65 nm and beyond. It provides excellent uniformity and defect control on a reliable wafer transport system. The symmetric chamber and radial tuning features produce uniform etch results for advanced devices. It employs proprietary technology for process repeatability, low defect, and metal contamination results. It supports conventional applications such as gate and shallow trench isolation (STI) and emerging applications such as high k dielectric removal, critical spacer etch, and lithography-enabling etch steps. The system can be upgraded from the 2300 Versys Star, providing an investment-extending strategy.문서
문서 없음