메인 콘텐츠로 건너뛰기
6" Fab For Sale from Moov - Click Here to Learn More
6" Fab For Sale from Moov - Click Here to Learn More
Moov logo

6" Fab For Sale from Moov - Click Here to Learn More
Moov Icon

2300 SYNDION

카테고리
Dry / Plasma Etch
개요

The 2300 Syndion, which also employs TCP technology, addresses 3-D IC through-silicon via (TSV) etch applications. TSVs provide the interconnects for die-to-die and wafer-to-wafer stacking, eliminating wire bonding to increase device packing density (smaller form factor) and improve performance (higher process speed and lower power requirements). Important for TSV applications, the Syndion’s TCP-based technology enables sequential processing the same chamber while ensuring etch rate uniformity and profile symmetry to prevent tilting. The technology also supports clean mode operation and provides bias voltage control for process repeatability.

활성 등재물

0

서비스

검사, 보험, 감정, 물류

상위 등재물

    제품을 찾을 수 없음
이런 제품이 있으신가요?
Moov에 등재하고 즉시 완벽한 구매자를 찾으십시오.