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The Transformer-Coupled Plasma (TCP) 9100 system is a high-density oxide-etch system announced by Lam Research Corp. It is designed to meet the full spectrum of requirements in oxide-etch processing and manufacturing for advanced microprocessor and memory devices. The TCP 9100 is the industry’s first tool that combines high throughput with high etch rates and advanced process performance, while etching devices in the deep submicron regime, with minimum feature sizes of less than 0.35 micron. It responds to chipmakers’ need for an oxide-etch method that can meet their dual requirements for 0.25-micron processing capability and consistent production performance. The TCP 9100 system is a multichamber cluster tool on Lam’s Advanced Capability Alliance platform, capable of supporting up to four process chambers.