Condition: Complete, never fully installed. No materials exposure or processes have ever been run.
Status: Partially installed

Note: The system was purchased in 2022, and delivered in 2023. Due to process change, it was never fully installed or ran in any process.

Detailed specifications
Plasma Generation:
RF low power bias kit Option - Power damping for lower electrode power with auto switching between low and high power ranges (<30W and >30W) to allow accurate control in the 0.2 - 30 Watt range. Wide range patented Oxford Instruments Plasma Technology automatic matching unit (AMU).

ALE gas dose kit Option - Gas dose kit for atomic layer etch. The ALE gas dose hardware enables short (down to 10msec pulses), controlled, reproducible gas doses required for the ALE process.

RF 600W generator & amu match for ETCH - 600W 13.56MHz RF generator for etch processes. Connected to lower electrode via a vacuum capacitor automatch unit.

Cobra300 3kW ICP plasma etch source (inc RF generator & amu) - 3kW 2MHz RF generator connected to 300mm diameter ICP source via a vacuum capacitor automatch unit. Includes laser endpoint detector port and mounting.

Electrostatic Shield for ICP plasma source - Electrostatic shield to suppress the capacitive coupling of the RF energy to the plasma. The plasma current circulates within the plasma and does not intersect the ICP tube, reducing process particles and providing improved control of plasma ion energies at substrate surface.

Substrate Electrode:
Electrostatic clamped fluid-cooled etch lower electrode kit - 240mm diameter electrostatic clamped lower electrode fluid cooled with a temperature range of -10°C to +60°C. It is capable of clamping di-electric, semi-conducting and conducting wafers up to 200mm diameter. The electrode is fixed height with an integral dark space shield and helium assisted heat transfer.

Julabo FP51 chiller - Remotely controlled air-cooled recirculating heater/chiller unit suitable for ultra-low electrode temperature control. Temperature stability of ±0.5 °C, and 1500 watts of cooling at 0 °C.

10m chiller cable - 10m cable to connect control rack to chiller.

Interdigitated puck for 100mm wafers with 32.5mm flat - Interdigitated puck for electrostatic clamping of di-electric, semi-conducting and conducting substrates through patented control technology.

Sacrificial ring - Quartz - Quartz sacrificial ring gives the cleanest process but shorter lifetime.

Gas Supply:
Standard Gas Pod externally mounted (8 lines max) - The gas pod is ventilated and fitted with an extraction port for maximum safety. Positions are provided for up to 8 mass flow-controlled gas lines, with control pneumatics and circuitry for 8 lines included. Fixing points are provided for wall mounting.

Split gas manifold, 2 points, 1 chamber Option - Split gas manifold to provide two separate gas outlets from the external gaspod into the same process chamber.

Gasline heating kit suitable for toxic gasline - Toxic gas line heating kit used for low vapour pressure gases, typically required for SiCl4 and BCl3.

Gas pod wall mounted  - Gas pod provided ready for wall mounting remote from the system console.

15m gas pod power cable - 15m power distribution cable from control rack to gas pod.

MKS MFCs - 4x Standard gasline and MFC for non-toxic gases (3 used, 1 extra with MFC & capped)
- Non-toxic gas line with digital, programmable mass flow controller. The line has stainless steel VCR fittings and orbitally welded joints, including one electro-pneumatic isolation valve and one in-line 2μm filter. For use with non-toxic, non-flammable, non-pyrophoric gases only.

3x By-passed gasline and MFC for toxic gases - Toxic gas line with metal sealed digital, programmable mass flow controller. Line has stainless steel VCR fittings and orbitally welded joints, including two electro-pneumatic isolation valves, one in-line 2μm filter and a bypass line. For use with toxic, flammable, and pyrophoric gases.

Vacuum Measurement:
100mT CM gauge - 100 mTorr capacitance manometer gauge used for process pressure measurement. Temperature controlled for improved stability and repeatability. Pressure read-back in mTorr.

Process pumping:
Adixen ATH1600MT turbo, ISO200 pipework, apc & heated backing valve kit
- Corrosive compatible, magnetic bearing turbomolecular pump including integration kit for use on a process chamber. Heated turbo backing valve.
VAT automatic pressure control valve for pressure control and chamber isolation.

Pfeiffer A124H ELT pump kit
- 110 m3/hr dry pump for process turbo backing. Extended Low Temperature version, recommended for all applications requiring the pump and gas temperature to be as low as possible to avoid any by-product deposition inside the pump. Features N2 purge facilities with standby mode for reduced running cost, software remote control with status monitoring and water cooling for precise temperature management. Includes hardware to integrate the pump to the system process chamber, with flexible tubing (1m).
15m power distribution cable from control rack to pump.

PlasmaPro 100 Chamber and pump down pipe Heating Kit - Electrical heating kit to warm the chamber and pump down pipework, minimising process deposition. Maximum temperature 60°C. The kit includes heat shields.

PlasmaPro 100 Pumping Foreline Heating Kit - Electrical heating kit for warming internal foreline pipework to minimise process deposition with a maximum temperature 80°C.

End-Point Detector:
Variable wavelength Verity SD1024GH optical EPD kit
200-800nm spectrometer integrated into the tool software via a standalone PC and dedicated endpoint software. The endpoint conditions are set up on the Verity PC before starting a process recipe. The tool software signals to the Verity at the start of a process when an optical emission endpoint is required and receives a signal back from the Verity when the endpoint condition is satisfied. The CCD spectrometer monitors multiple lines simultaneously, which allows complex endpoint conditions to be specified, such as a reduction in one emission line and the increase in another line. Features lower noise electronics compared with the SD1024G and high efficiency optics for use with low light level.

Wafer Handling:
PlasmaPro100 Single loadlock kit
Load lock for up to 200mm diameter single wafer or batch carrier platen operation. Substrates are loaded directly onto the wafer transfer arm via a hinged lid. Transfer isolation valve fitted between the load lock and the process chamber. Substrates may be transferred under vacuum into the single process chamber. Includes sensor to monitor wafer transfer status (minimum detectable wafer size of 100mm. The wafer presence sensor (laser) must be disabled in software for single wafers smaller than 100mm, alternatively a wafer carrier platen can be used.

Loadlock Pumping:
Roughing only to Dry Pump - Isolation Valve included

Loadlock soft pump kit - Allows for gradual chamber pumping to prevent wafer movement and minimise particle generation.

Loadlock soft vent kit - Allows for gradual chamber venting to prevent wafer movement and minimise particle generation.

Pfeiffer ACP15G dry pump kit - 14 m3/hr dry pump with hardware to integrate the pump to the loadlock, including flexible tubing (1m)

PLASMAPRO 100 COBRA(6).MOV

PLASMAPRO 100 COBRA(4).MOV

PLASMAPRO 100 COBRA(8).MOV

PLASMAPRO 100 COBRA(7).MOV

PLASMAPRO 100 COBRA(5).MOV

PLASMAPRO 100 COBRA(3).MOV

PLASMAPRO 100 COBRA(2).MOV

PLASMAPRO 100 COBRA.MOV

Plasmapro Cobra.pdf

A4 Series Dry pumps Manual.pdf

CS NovaSafe_CS Final 2.pdf

JULABO-FP51-SL.pdf

Oxford PlasmaPro 100 Cobra.pdf

OXFORD

PLASMAPRO 100 COBRA

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OXFORD

PLASMAPRO 100 COBRA

Dry / Plasma Etch

유사 등재물

OXFORD

PLASMAPRO 100 COBRA

PLASMAPRO 100 COBRA

Dry / Plasma Etch

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OXFORD

PLASMAPRO 100 COBRA