설명
CU PLATING환경 설정
CU PLATINGOEM 모델 설명
The Endura Electra Cu™ System is a production-proven solution for copper interconnect metallization. It utilizes IMP-based technologies in a revolutionary process sequence to deposit a barrier layer of tantalum (Ta) or tantalum nitride (TaN), followed by a thin seed layer of copper in an IMP Cu chamber. This provides the critical base needed for successful subsequent bulk copper fill. The Endura Electra Cu system is currently being used by industry leaders and is the first-production capable system of its kind.문서
문서 없음
APPLIED MATERIALS (AMAT)
ENDURA ELECTRA Cu
검증됨
카테고리
PVD / Sputtering
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
56163
웨이퍼 사이즈:
12"/300mm
빈티지:
2000
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
APPLIED MATERIALS (AMAT)
ENDURA ELECTRA Cu
검증됨
카테고리
PVD / Sputtering
마지막 검증일: 60일 이상 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
56163
웨이퍼 사이즈:
12"/300mm
빈티지:
2000
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
설명
CU PLATING환경 설정
CU PLATINGOEM 모델 설명
The Endura Electra Cu™ System is a production-proven solution for copper interconnect metallization. It utilizes IMP-based technologies in a revolutionary process sequence to deposit a barrier layer of tantalum (Ta) or tantalum nitride (TaN), followed by a thin seed layer of copper in an IMP Cu chamber. This provides the critical base needed for successful subsequent bulk copper fill. The Endura Electra Cu system is currently being used by industry leaders and is the first-production capable system of its kind.문서
문서 없음