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ENDURA ELECTRA Cu

카테고리
PVD / Sputtering
개요

The Endura Electra Cu™ System is a production-proven solution for copper interconnect metallization. It utilizes IMP-based technologies in a revolutionary process sequence to deposit a barrier layer of tantalum (Ta) or tantalum nitride (TaN), followed by a thin seed layer of copper in an IMP Cu chamber. This provides the critical base needed for successful subsequent bulk copper fill. The Endura Electra Cu system is currently being used by industry leaders and is the first-production capable system of its kind.

활성 등재물

3

서비스

검사, 보험, 감정, 물류

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