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APPLIED MATERIALS (AMAT) / SEMITOOL RAIDER ECD310
  • APPLIED MATERIALS (AMAT) / SEMITOOL RAIDER ECD310
  • APPLIED MATERIALS (AMAT) / SEMITOOL RAIDER ECD310
  • APPLIED MATERIALS (AMAT) / SEMITOOL RAIDER ECD310
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환경 설정
RE10F3ECD124
OEM 모델 설명
The Raider™ ECD310 is a fourth-generation, single-wafer, automated, multi-process electrochemical deposition tool. It delivers advanced metal processing in a small footprint and is available with cluster modules for metrology, plating, and cleaning. The Raider™ ECD310 incorporates programmable reactors that provide an ECD seed layer, a full solution for copper fill with uniformity and film characteristics, and integrated removal of all backside, bevel, and edge copper contamination and seed layer edge exclusion etch. Additionally, in-situ anneal is available. This tool is designed to deliver advanced metal processing capabilities in a compact package.
문서

문서 없음

카테고리
Electro Plating

마지막 검증일: 7일 전

주요 품목 세부 정보

조건:

Used


작동 상태:

알 수 없음


제품 ID:

119537


웨이퍼 사이즈:

알 수 없음


빈티지:

2006


Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available

APPLIED MATERIALS (AMAT) / SEMITOOL

RAIDER ECD310

verified-listing-icon
검증됨
카테고리
Electro Plating
마지막 검증일: 7일 전
listing-photo-f972afdebb7e45e2ab02faae5abd1f37-https://d2pkkbyngq3xpw.cloudfront.net/moov_media/3.0-assets/photo-coming-soon-small.png
주요 품목 세부 정보

조건:

Used


작동 상태:

알 수 없음


제품 ID:

119537


웨이퍼 사이즈:

알 수 없음


빈티지:

2006


Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
설명
설명 없음
환경 설정
RE10F3ECD124
OEM 모델 설명
The Raider™ ECD310 is a fourth-generation, single-wafer, automated, multi-process electrochemical deposition tool. It delivers advanced metal processing in a small footprint and is available with cluster modules for metrology, plating, and cleaning. The Raider™ ECD310 incorporates programmable reactors that provide an ECD seed layer, a full solution for copper fill with uniformity and film characteristics, and integrated removal of all backside, bevel, and edge copper contamination and seed layer edge exclusion etch. Additionally, in-situ anneal is available. This tool is designed to deliver advanced metal processing capabilities in a compact package.
문서

문서 없음