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The Applied Raider® Edge ECD (electrochemical deposition) system is the industry benchmark for single wafer electroplating technology. The Raider Edge offers flexibility with wafer sizes at 150, 200 and 300mm. Supporting multiple applications on one platform, it is capable of plating and etching a wide range of metals and alloys in addition to cleaning and dielectric layer etching and can work with multiple substrate types & thicknesses.