설명
METAL (CU)환경 설정
Cu process, FI (Brooks L/P X3, brooks robot, controller, aligner), Backend, chase PC, Front PC, NCT, DUCT X3, Parts boxOEM 모델 설명
The SABRE Extreme, an advanced Electrofill system that has been qualified at 45 nanometers and has demonstrated fill at 32 nanometers. The SABRE Extreme incorporates a number of technological innovations for advanced manufacturing applications, including advanced wafer entry control for thin seed layers (< 200A), tunable profile control for improved uniformities, and the capability to plate on non-copper seed materials.문서
문서 없음
LAM RESEARCH / NOVELLUS
SABRE EXTREME
검증됨
카테고리
Electro Plating
마지막 검증일: 60일 이상 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
95976
웨이퍼 사이즈:
12"/300mm
빈티지:
2008
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
LAM RESEARCH / NOVELLUS
SABRE EXTREME
카테고리
Electro Plating
마지막 검증일: 60일 이상 전
주요 품목 세부 정보
조건:
Used
작동 상태:
알 수 없음
제품 ID:
95976
웨이퍼 사이즈:
12"/300mm
빈티지:
2008
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
설명
METAL (CU)환경 설정
Cu process, FI (Brooks L/P X3, brooks robot, controller, aligner), Backend, chase PC, Front PC, NCT, DUCT X3, Parts boxOEM 모델 설명
The SABRE Extreme, an advanced Electrofill system that has been qualified at 45 nanometers and has demonstrated fill at 32 nanometers. The SABRE Extreme incorporates a number of technological innovations for advanced manufacturing applications, including advanced wafer entry control for thin seed layers (< 200A), tunable profile control for improved uniformities, and the capability to plate on non-copper seed materials.문서
문서 없음