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High-Power Burn-In System For 150-Watt VLSI Devices Micro Control Company announces its new HPB-2 high-power burn-in system. The HPB-2 was designed to meet the challenge of wide variations in heat dissipation and the diverse burn-in needs created by high-power VLSI devices of up to 150 watts. The HPB-2 provides precise, individual temperature control for each device under test while supporting a wide range of test strategies. Features -Burn-in and test up to 150-watt VLSI devices -Individual device under test temperature control to within ±3˚ C -128 I/O channels per driver/receiver -Programmable temperature control from 50˚ C to 150˚ C -ASIC architecture for per-pin timing, testing, and formatting -Timing on the fly, programmable edges and rep-rate with 10-nanosecond -resolution -8 vector formats per pin per cycle -Up to 50 amps of programmable power to the device under test -Clock rate of 2 to 400 MHz, programmable