TEL / TOKYO ELECTRON
NT333
Ovens / Environmental / Climate Chambers
빈티지: 알 수 없음
조건: 현 상태 그대로
마지막 검증일
60일 이상 전
NT333™ has large wafer capacity as compared to single or dual wafer processing techniques. With the added capability of pre or post treatment steps included in each ALD cycle, NT333™ is capable of forming films of the highest quality while operating at low temperatures and providing tunable film stresses for a variety of applications. Additionally, NT333™ has unique plasma shield which mitigates plasma damage resulting in high quality films while maintain high stage rotation speeds.
4
검사, 보험, 감정, 물류
Ovens / Environmental / Climate Chambers
Ovens / Environmental / Climate Chambers
Ovens / Environmental / Climate Chambers
Ovens / Environmental / Climate Chambers