메인 콘텐츠로 건너뛰기

NT333

카테고리
ALD
개요

NT333™ has large wafer capacity as compared to single or dual wafer processing techniques. With the added capability of pre or post treatment steps included in each ALD cycle, NT333™ is capable of forming films of the highest quality while operating at low temperatures and providing tunable film stresses for a variety of applications. Additionally, NT333™ has unique plasma shield which mitigates plasma damage resulting in high quality films while maintain high stage rotation speeds.

활성 등재물

9

서비스

검사, 보험, 감정, 물류

이런 제품이 있으신가요?
Moov에 등재하고 즉시 완벽한 구매자를 찾으십시오.