SYNDION FS
카테고리
Etch/Asher개요
Syndion® F-Series TSV for high bandwidth memory and advanced packaging High aspect ratio structures for CMOS image sensors Large open area and high aspect ratio structures for advanced power devices, analog integrated circuits (ICs), microelectromechanical (MEMS) devices and wafer backside processing
활성 등재물
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서비스
검사, 보험, 감정, 물류
상위 등재물
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